Glassclad EG - 20% Solids In Xylene (PS225)

CAS Number: NA

Product Code: PS225
Description

Details

Glassclad EG 20% Solids In Xylene

PS225 is a thermally stable resin which forms a moderately flexible film with excellent adhesion and low chloride content. It provides an oxidation and mechanical barrier for resistors and circuit boards. Part application is by spraying or dipping. Cure is 20 minutes at 220°C.

To request a quote email customerservice@unitedchem.com. Be sure to include product code and requested quantity.

Additional Information

Additional Information

Name Glassclad EG - 20% Solids In Xylene (PS225)
Description

Glassclad EG 20% Solids In Xylene

PS225 is a thermally stable resin which forms a moderately flexible film with excellent adhesion and low chloride content. It provides an oxidation and mechanical barrier for resistors and circuit boards. Part application is by spraying or dipping. Cure is 20 minutes at 220°C.

To request a quote email customerservice@unitedchem.com. Be sure to include product code and requested quantity.

UCT Formula No
UCT CAS Number NA
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